Editorial Board
Professor
Zeng Gao
Associate Editor
School of Materials Science and Engineering, Henan Polytechnic University, Jiaozuo
Website
| E-Mail: gaozeng@hpu.edu.cn
Interests: Microelectronics Interconnection Technology: Fundamental theory and practical applications.
Special Joining Techniques for Advanced Materials: Mechanism and application development.
Welding and Application of Composite Materials.
Green Joining Technologies and Numerical Simulation of Light Alloys.
Professor
Yuan Cheng
Editorial Board Member
Nuclear Power Institute of China (NPIC)
E-Mail: chengyuan@npic.ac.cn
Interests: Performance and microstructural evolution of alloy materials under service conditions
Dr.
Hongshan San
Editorial Board Member
Henan Polytechnic University, Jiaozuo
Website
| E-Mail: hongshansan@hpu.edu.cn
Interests: Corrosion and corrosion protection of metallic materials; additive manufacturing; surface engineering and protective coatings; electrochemical surface modification; micro-arc oxidation; electrodeposition; biofunctionalization of metallic surfaces; degradation behaviour of metallic materials.
Professor
Changdong Gu
Deputy Editor
School of Materials Science & Engineering, Zhejiang University, Zijingang Campus, Hangzhou
Website
| E-Mail: cdgu@zju.edu.cn
Interests: Coatings; Energy Storage Materials; Deep Eutectic Solvents and Ionic Liquids; Copper Foil Materials; Metal Corrosion and Protection
